共 50 条
- [1] Patterning characteristics of hole patterns in synchrotron radiation lithography JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1998, 37 (4A): : 2062 - 2065
- [2] Proximity effect on patterning characteristics of hole patterns in synchrotron radiation lithography Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1994, 33 (10): : 6046 - 6053
- [3] PROXIMITY EFFECT ON PATTERNING CHARACTERISTICS OF HOLE PATTERNS IN SYNCHROTRON-RADIATION LITHOGRAPHY JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1994, 33 (10): : 6046 - 6053
- [4] Effect of mechanical vibration on patterning characteristics in synchrotron radiation lithography Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1996, 35 (12 B): : 6347 - 6695
- [5] Effect of mechanical vibration on patterning characteristics in synchrotron radiation lithography JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1996, 35 (12B): : 6458 - 6462
- [6] RESOLUTION ENHANCEMENT OF HOLE PATTERNS IN SYNCHROTRON-RADIATION LITHOGRAPHY JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1993, 32 (12B): : 5971 - 5976
- [7] Patterning characteristics of a chemically-amplified negative resist in synchrotron radiation lithography Deguchi, Kimiyoshi, 1600, (31):
- [8] PATTERNING CHARACTERISTICS OF A CHEMICALLY-AMPLIFIED NEGATIVE RESIST IN SYNCHROTRON RADIATION LITHOGRAPHY JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1992, 31 (9A): : 2954 - 2958
- [9] Patterning characteristics of 0.1-μm line-and-space pattern in synchrotron radiation lithography Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1994, 33 (11): : 6389 - 6395
- [10] Patterning of burnishing head for hard disk platters by synchrotron radiation lithography Microsystem Technologies, 2014, 20 : 2203 - 2211