LIQUID PHASE MIGRATION DURING SINTERING OF LOW-POROSITY Cu-Pb MATERIALS.

被引：0
|
作者：
Skorokhod, V.V. [1 ]
Solonin, S.M. [1 ]
Epifantseva, T.A. [1 ]
Savyak, M.P. [1 ]
机构：
[1] Acad of Sciences of the Ukrainian, SSR, USSR, Acad of Sciences of the Ukrainian SSR, USSR
来源：
Soviet powder metallurgy and metal ceramics | 1985年 / 24卷 / 10期
关键词：
ANTIFRICTION MATERIALS - LEAD SWEATING - LIQUID PHASE MIGRATION - SINTERING - WETTING;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
During sintering of hard-pressed components from copper and lead powder mixtures, sweating of lead occurs at the moment of melting under the action of expelling capillary force. Lead oxides hinder wetting. The exuded lead reinfiltration process begins after removal of led oxides and changes in the wetting behavior. Addition of chromium intensifies the reverse suction of the liquid phase. By sintering in argon it proceeds faster than during sintering in hydrogen due to better wetting of copper with molten lead. Sintering in argon obtains samples with little porosity.
引用
收藏
页码：765 / 768
相关论文
共 50 条
  • [31] DIMENSIONAL CHANGES DURING LIQUID-PHASE SINTERING OF FE-CU COMPACTS
    TABESHFAR, K
    CHADWICK, GA
    POWDER METALLURGY, 1984, 27 (01) : 19 - 24
  • [32] Low temperature and low pressure bonding of plateless Cu–Cu substrates by Ag-based transient liquid phase sintering
    Khairi Faiz Muhammad
    Takehiro Yamamoto
    Makoto Yoshida
    Journal of Materials Science: Materials in Electronics, 2017, 28 : 9351 - 9362
  • [33] Distortion and densification control during liquid phase sintering of high-performance materials
    German, RM
    Chung, SH
    Blaine, D
    MATERIALS PROCESSING AND DESIGN: MODELING, SIMULATION AND APPLICATIONS, PTS 1 AND 2, 2004, 712 : 1320 - 1325
  • [34] DILATOMETRIC INVESTIGATIONS OF THE PROCESSES OF LIQUID-PHASE SINTERING OF MATERIALS OF THE Cu-Sn SYSTEM.
    Savitskii, A.P.
    Burtsev, N.N.
    Emel'yanova, M.A.
    Soviet powder metallurgy and metal ceramics, 1984, 23 (09): : 679 - 682
  • [35] THE PROPERTIES OF Fe-Ni-Mo-Cu-B MATERIALS PRODUCED VIA LIQUID PHASE SINTERING
    Karwan-Baczewska, J.
    ARCHIVES OF METALLURGY AND MATERIALS, 2011, 56 (03) : 789 - 796
  • [36] Low temperature and low pressure bonding of plateless Cu-Cu substrates by Ag-based transient liquid phase sintering
    Muhammad, Khairi Faiz
    Yamamoto, Takehiro
    Yoshida, Makoto
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 28 (13) : 9351 - 9362
  • [37] Gravity-induced sedimentation during melting and liquid phase sintering of Pb-Sn alloys
    Du, Y
    Courtney, TH
    Lu, SZ
    ACTA MATERIALIA, 2003, 51 (02) : 445 - 456
  • [38] Simulation of densification process of W-Cu system during liquid-phase sintering
    Qu, X.-H. (quxh@ustb.edu.cn), 1600, Central South University of Technology (24):
  • [39] Solution-reprecipitation mechanism in Fe-Cu-C during liquid phase sintering
    Kuroki, H
    Han, G
    Shinozaki, K
    INTERNATIONAL JOURNAL OF POWDER METALLURGY, 1999, 35 (02): : 57 - 62
  • [40] Effect of microgravity on grain coarsening during liquid phase sintering in the Fe-Cu system
    Naser, J
    Smith, JE
    Kuruvilla, AK
    JOURNAL OF MATERIALS SCIENCE, 1998, 33 (23) : 5573 - 5580
12345