共 50 条
- [22] Speckle interferometry with temporal phase evaluation: Optimization of imaging apertures for in-plane displacement OPTIK, 2001, 112 (09): : 421 - 426
- [23] Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2004, 380 (1-2): : 231 - 236
- [30] The Extension of the Electronic Speckle Photography to the Measurement of In-Plane Displacement MAPAN, 2018, 33 : 377 - 384