Crack mechanism in wire bonding joints

被引：0
|
作者：
Ramminger, S. [1 ]
Tuerkes, P. [1 ]
Wachutka, G. [1 ]
机构：
[1] Siemens AG, Munich, Germany
来源：
Microelectronics Reliability | 1998年 / 38卷 / 6-8期
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D O I：
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学科分类号：
摘要：
5
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页码：1301 / 1305
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