Silver-palladium thick-film conductors

被引：0

作者：

机构：

[1] Wang, Sea Fue

[2] Dougherty, Joseph P.

[3] Huebner, Wayne

[4] Pepin, John G.

来源：

Wang, Sea Fue | 1600年 / American Ceramic Soc, Westerville, OH, United States卷 / 77期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

共 50 条

[21] THICK-FILM CONDUCTORS FROM GENERIC ORGANOMETALLIC PRECURSORS
JOSHI, GM
VEST, RW
AMERICAN CERAMIC SOCIETY BULLETIN, 1980, 59 (08): : 830 - 830
[22] HIGH-PERFORMANCE THICK-FILM GOLD CONDUCTORS
GETTY, RR
TAYLOR, BE
NEEDES, CRS
SOLID STATE TECHNOLOGY, 1983, 26 (10) : 163 - 168
[23] ADHESION OF THICK-FILM CONDUCTORS - MECHANISMS AND PROCESSING EFFECTS
BECHER, PF
AMERICAN CERAMIC SOCIETY BULLETIN, 1979, 58 (03): : 363 - 363
[24] EFFECTS OF ADDITIVES ON PROPERTIES OF THICK-FILM COPPER CONDUCTORS
KUO, CY
AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (08): : 815 - 815
[25] Laser sintering of thick-film conductors for microelectronic applications
Kinzel, Edward C.
Sigmarsson, Hjalti H.
Xu, Xianfan
Chappell, William J.
JOURNAL OF APPLIED PHYSICS, 2007, 101 (06)
[26] REPRODUCIBLE ADHESION TEST FOR SOLDERED THICK-FILM CONDUCTORS
HITCH, TT
AMERICAN CERAMIC SOCIETY BULLETIN, 1980, 59 (03): : 378 - 378
[27] INTERFACING OF CONDUCTORS WITH THICK-FILM MATERIALS FOR HYBRID MICROELECTRONICS
COUNTS, WE
VITRIOL, WA
AMERICAN CERAMIC SOCIETY BULLETIN, 1974, 53 (08): : 606 - 606
[28] SILVER MIGRATION AND THE RELIABILITY OF PD-AG CONDUCTORS IN THICK-FILM DIELECTRIC CROSSOVER STRUCTURES
NAGUIB, HM
MACLAURIN, BK
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (02): : 196 - 207
[29] THICK-FILM RESISTORS WITH THIN-FILM CONDUCTORS - COMPATIBILITY STUDY
CURNAN, HJ
BROWN, R
AMERICAN CERAMIC SOCIETY BULLETIN, 1974, 53 (08): : 606 - 606
[30] SILVER-PALLADIUM THERMOCOUPLES
BARBER, CR
PEMBERTON, LH
JOURNAL OF SCIENTIFIC INSTRUMENTS, 1955, 32 (12): : 486 - 487

← 1 2 3 4 5 →