Preparation of Cu10Zr7 intermetallic compound film and its application as a diffusion barrier in Cu/Cu10Zr7/ZrN/Si contact system

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Asahikawa Natl Coll of Technology, Asahikawa, Japan [1 ]
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Jpn J Appl Phys Part 1 Regul Pap Short Note Rev Pap | / 12 A卷 / 7302-7306期
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