Photoelastic measurement of strain induced by die-bonding of GaAs chip on a copper heatsink plate

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作者：
Chu, Tao [1 ]
Yamada, Masayoshi [1 ]
机构：
[1] Dept. of Electronics and Info. Sci., Kyoto Institute of Technology, Matsugasaki, Sakyo-ku, Kyoto 606, Japan
来源：
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 1999年 / 38卷 / 2 B期
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页码：1153 / 1155
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