HIGH RESOLUTION e-BEAM LITHOGRAPHY FOR X-RAY MASK MAKING.

被引:4
|
作者
Pongratz, S. [1 ]
Reimer, K. [1 ]
Demmeler, R. [1 ]
Ehrlich, Ch. [1 ]
机构
[1] Fraunhofer-Inst fuer, Mikrostrukturtechnik, Berlin, West, Ger, Fraunhofer-Inst fuer Mikrostrukturtechnik, Berlin, West Ger
关键词
ELECTRON BEAMS - MATHEMATICAL STATISTICS - Monte Carlo Methods - MICROELECTRONICS - X-RAYS;
D O I
10.1016/0167-9317(87)90026-8
中图分类号
学科分类号
摘要
The electron energy of, e. g. , 50 keV has advantages over less electron energy for X-ray mask substrates because the influence of the proximity effect is reduced. However, also in the case of writing with high energy electrons on thin membranes, the proximity effect cannot be neglected. Starting with one experimentally defined exposure dose the calculation of the proximity compensation dose is made by the Monte Carlo simulation and the proximity function. High resolution structures down to 50 nm were written on X-ray mask substrates as well as on bulk silicon wafer and compared with CAD data. The pattern placement accuracy of the e-beam system was investigated for the resolution of 50 nm over the stepfield of 3 multiplied by 3 cm**2 on an X-ray mask.
引用
收藏
页码:123 / 128
相关论文
共 50 条
  • [41] PROSPECTS OF HIGH RESOLUTION X-RAY LITHOGRAPHY.
    Aristov, V.V.
    Erko, A.I.
    Kudryashov, V.A.
    Microelectronic Engineering, 1985, 3 (1-4) : 589 - 595
  • [42] Focal Spot Size Enhancement by Offset control of Triode e-beam Module for High Resolution X-ray Imaging
    Yu, Yi Yin
    Park, Kyu Chang
    2021 34TH INTERNATIONAL VACUUM NANOELECTRONICS CONFERENCE (IVNC), 2021, : 193 - 194
  • [43] Advanced photomask fabrication by e-beam lithography for mask aligner applications
    Weichelt, T.
    Bourgin, Y.
    Banasch, M.
    Zeitner, U. D.
    32ND EUROPEAN MASK AND LITHOGRAPHY CONFERENCE, 2016, 10032
  • [44] FABRICATION OF CARBON MEMBRANE X-RAY MASK FOR X-RAY LITHOGRAPHY
    Noda, Daiji
    Takahashi, Naoki
    Tokuoka, Atsushi
    Katori, Megumi
    Hattori, Tadashi
    PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION (IMECE 2010), VOL 10, 2012, : 279 - 283
  • [45] Dose latitude dependency on resist contrast in e-beam mask lithography
    Cha, BC
    Moon, SY
    Ki, WT
    Yang, SH
    Choi, SW
    Han, WS
    Yoon, HS
    Sohn, JM
    PHOTOMASK AND NEXT-GENERATION LITHOGRAPHY MASK TECHNOLOGY VII, 2000, 4066 : 200 - 209
  • [46] Advances in High Intensity e-Beam Diode Development for Flash X-Ray Radiography
    Oliver, B. V.
    Hahn, K.
    Johnston, M. D.
    Portillo, S.
    ACTA PHYSICA POLONICA A, 2009, 115 (06) : 1044 - 1046
  • [47] Chemically amplified resist approaches for e-beam lithography mask fabrication
    Maldonado, JR
    Angelopoulos, M
    Huang, W
    Brainard, RL
    Guevremont, JM
    Tan, Z
    NANOPATTERNING-FROM ULTRALARGE-SCALE INTERGRATION TO BIOTECHNOLOGY, 2002, 705 : 35 - 47
  • [48] E-BEAM METROLOGY OF CHROMIUM MASTER MASKS AND OF MASKS FOR X-RAY-LITHOGRAPHY
    BRUENGER, WH
    BETZ, H
    HEUBERGER, A
    MULLER, KP
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1985, 3 (01): : 237 - 240
  • [49] Determination of residual resist layer thickness in e-beam lithography based on energy dispersive x-ray spectrometer
    Lee, YC
    Chiu, CY
    Liu, CP
    Hsiao, FB
    Chen, CH
    PROGRESS ON ADVANCED MANUFACTURE FOR MICRO/NANO TECHNOLOGY 2005, PT 1 AND 2, 2006, 505-507 : 43 - 48
  • [50] Pattern resolution in X-ray lithography using pattern replication technique on a mask
    Kise, K
    Amemiya, M
    Watanabe, H
    Itoga, K
    Yabe, H
    Sumitani, H
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2003, 42 (6B): : 3796 - 3801