Wetting kinetics and the interfacial interaction behavior between electroless Ni-Cu-P and molten solder

被引：0
|
作者：
Lee, Chwan-Ying [1 ]
Lin, Kwang-Lung [1 ]
机构：
[1] Natl Cheng Kung Univ, Tainan, Taiwan
来源：
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 1994年 / 33卷 / 5 A期
关键词：
32;
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页码：2684 / 2688
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