Measurements of adhesive bondline effective thermal conductivity and thermal resistance using the laser flash method

被引：0
|
作者：
Campbell, Robert C. [1 ]
Smith, Stephen E. [1 ]
Dietz, Raymond L. [1 ]
机构：
[1] Holometrix, Bedford, United States
来源：
Annual IEEE Semiconductor Thermal Measurement and Management Symposium | 1999年
关键词：
Computer simulation - Heat resistance - Laser applications - Thermal conductivity of solids - Thermal variables measurement;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The variables that determine the adhesive bondline effective thermal conductivity and contact resistance were investigated. The results of the multi-layer laser flash conductivity measurements are presented for a range of available adhesives in sandwich sample assemblies that simulate the package. Thermal conductivity measurements of the adhesives free-standing were also obtained using laser flash method.
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页码：83 / 97
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