PACKAGING TO PROTECT SENSITIVE COMPONENTS.

被引:0
|
作者
Wells, Len [1 ]
机构
[1] Corrugated Products Ltd, Bracknell, Engl, Corrugated Products Ltd, Bracknell, Engl
来源
EP Electronic Production (London) | 1987年 / 16卷 / 06期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:31 / 32
相关论文
共 50 条
  • [1] PACKAGING TRENDS IN DISCRETE SURFACE MOUNT COMPONENTS.
    Hollander, Dave
    Surface mount technology, 1987, 1 (04): : 9 - 11
  • [2] METAL MATRIX COMPOSITES FOR MICROWAVE PACKAGING COMPONENTS.
    Thaw, C.
    Minet, R.
    Zemany, J.
    Zweben, C.
    Electronic Packaging and Production, 1987, 27 (08): : 27 - 29
  • [3] AUTOMATED INSPECTION TECHNIQUES FOR QUALITY CONTROL OF PACKAGING COMPONENTS.
    Alston, K.
    March, N.J.
    Quality assurance London, 1984, 10 (02): : 45 - 47
  • [4] GREATER PACKAGING DENSITY THROUGH DIRECT SURFACE MOUNTING OF COMPONENTS.
    Goel, R.P.
    SMT Surface Mount Technology Magazine, 1986, : 17 - 20
  • [5] LOW COST PACKAGING TECHNIQUES FOR MILLIMETRE-WAVE COMPONENTS.
    Bates, R.N.
    Slater, R.A.M.
    Annual Review - Philips Research Laboratories, 1986, : 113 - 115
  • [6] COMPONENTS.
    Ormond, Tom
    EDN, 1981, 26 (14) : 302 - 316
  • [7] COMPONENTS.
    Allan, Roger
    Electronics, 1980, 53 (23): : 170 - 174
  • [8] Inherently conductive polymers protect sensitive components
    Graff, G
    MODERN PLASTICS, 1999, 76 (03): : 30 - 32
  • [9] PACKAGING AND ASSEMBLY OF D10 ELECTRONIC SWITHCING SYSTEM AND ITS COMPONENTS.
    Tamura, Akio
    Tachibana, Yoshio
    Kasuga, Kazuo
    Furuya, Masao
    Kikukawa, Hisayoshi
    Kurabe, Hirotoshi
    Tabata, Kotaro
    Hitachi Review, 1973, 22 (07): : 305 - 315
  • [10] PASSIVE COMPONENTS.
    Anon
    Electronic Engineering (London), 1987, 59 (728): : 46 - 48