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- [42] Application of Contactless Testing to PCBs with BGAs and Open Sockets JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 2015, 31 (04): : 339 - 347
- [43] PERIMETER BGAS PROMISE EASIER ROUTING, HIGHER PERFORMANCE ELECTRONIC PRODUCTS MAGAZINE, 1995, 37 (08): : 17 - 17
- [44] Application of Contactless Testing to PCBs with BGAs and Open Sockets Journal of Electronic Testing, 2015, 31 : 339 - 347
- [45] Does BGAs require new PCB-Technologies? F and M; Feinwerktechnik, Mikrotechnik, Messtechnik, 1995, 103 (11-12): : 687 - 690
- [46] Printed circuit assembly with no lead solder assembly process PROCEEDINGS OF THE 1997 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND THE ENVIRONMENT - ISEE-1997, 1997, : 25 - 27
- [47] Assembly phase estimation in the square peg assembly process 2012 12TH INTERNATIONAL CONFERENCE ON CONTROL, AUTOMATION AND SYSTEMS (ICCAS), 2012, : 2135 - 2138
- [48] Cost effective approach to fine pitch BGAs 1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS, 1997, : 154 - 159
- [49] Accessing Adhesive Induced Risk for BGAs in Temperature Cycling 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 395 - 403