共 50 条
- [32] Integration of environmental factors in process modeling for printed circuit board manufacturing .2. Fabrication PROCEEDINGS OF THE 1997 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND THE ENVIRONMENT - ISEE-1997, 1997, : 226 - 233
- [33] Integration of environmental factors in process modeling for printed circuit board manufacturing .1. Assembly PROCEEDINGS OF THE 1997 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND THE ENVIRONMENT - ISEE-1997, 1997, : 218 - 225
- [34] Studies of Silver Catalyst System in Print-Circuit Board Application 2018 13TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2018, : 89 - 92
- [36] Application of RFID System for the Process Control of Distributed Manufacturing System 2015 IEEE 28TH CANADIAN CONFERENCE ON ELECTRICAL AND COMPUTER ENGINEERING (CCECE), 2015, : 497 - 501
- [38] Application of dimensional analysis to the spin coating procedure in the manufacturing process of integrated circuit Kung Yeh Kung Chieng Hsueh K'an, 4 (381):
- [39] Monitoring System for Manufacturing Process Application to a Cardboard Factory 3RD INTERNATIONAL CONFERENCE ON CONTROL, ENGINEERING & INFORMATION TECHNOLOGY (CEIT 2015), 2015,
- [40] Development and Application of Networked Manufacturing Process Monitoring System PROCEEDINGS OF THE 2008 INTERNATIONAL SYMPOSIUM ON COMPUTATIONAL INTELLIGENCE AND DESIGN, VOL 1, 2008, : 432 - +