Bright Deposition of Tin-Lead Films.

被引：0

作者：

Hasko, F.

Bujtas, P.

Fath, R.

Karl, I.

机构：

来源：

Galvanotechnik | 1975年 / 66卷 / 06期

关键词：

D O I：

暂无

中图分类号：

TG17 [金属腐蚀与保护、金属表面处理]; TQ153 [电镀工业];

学科分类号：

080503 ;

摘要：

Brightly solderable, corrosion resistant tin-lead alloy deposits, applied by electroplating and particularly suited for electronics applications, are discussed.

引用

页码：478 / 482

共 50 条

[31] Surface chemistry of the atomic layer deposition of tin films.
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