Self-aligned, fluxless flip-chip bonding technology for photonic devices

被引：0
|
作者：
Kuhmann, J.F. [1 ]
Hensel, H.-J. [1 ]
Pech, D. [1 ]
Harde, P. [1 ]
Bach, H.-G. [1 ]
机构：
[1] Heinrich-Hertz-Inst fuer, Nachrichtentechnik Berlin GmbH, Berlin, Germany
来源：
Proceedings - Electronic Components and Technology Conference | 1996年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Flip chip devices
引用
收藏
页码：1088 / 1092
相关论文
共 50 条
  • [31] Flip-Chip Bonding Fabrication Technique
    Azmi, Tengku Muhammad Afif bin Tengku
    bin Sulaiman, Nadzril
    6TH INTERNATIONAL CONFERENCE ON MECHATRONICS (ICOM'17), 2017, 260
  • [32] METALLURGICAL STUDY OF FLIP-CHIP BONDING
    OHARA, H
    SATO, K
    KAMOSHIT.G
    METALLURGICAL TRANSACTIONS, 1970, 1 (03): : 679 - &
  • [33] IR laser flip-chip bonding
    Kim, Joohan
    Song, Chun-Sam
    Ji, Hyun-Sik
    Kim, Jong-Hyeong
    2007 INTERNATIONAL CONFERENCE ON CONTROL, AUTOMATION AND SYSTEMS, VOLS 1-6, 2007, : 1634 - +
  • [34] Flip-chip technology on PWBs
    Langan, JP
    PLATING AND SURFACE FINISHING, 1998, 85 (02): : 22 - 23
  • [35] Comparison of Stud Bump Bonding technology and other flip-chip technologies
    Ono, M
    Shiraishi, T
    Bessho, Y
    Eda, K
    Ishida, T
    1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 639 - 644
  • [36] Low cost packaging of semiconductor laser arrays using passive self-aligned flip-chip technique on Si motherboard
    Hunziker, W
    Vogt, W
    Melchior, H
    Germann, R
    Harder, C
    46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, : 8 - 12
  • [37] Fluxless flip chip bonding with joint-in-via architecture
    Lee, TK
    Zhang, S
    Wong, CC
    Tan, AC
    THIN SOLID FILMS, 2006, 504 (1-2) : 436 - 440
  • [38] 15-μm-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosonic flip-chip bonding technique for advanced chip stacking applications
    Bui Thanh Tung
    Kato, Fumiki
    Watanabe, Naoya
    Nemoto, Shunsuke
    Kikuchi, Katsuya
    Aoyagi, Masahiro
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2014, 53 (04)
  • [39] Aspects of Applying Flip-Chip Technology for SiC Power Devices Assembly
    Mysliwiec, Marcin
    Guziewicz, Marek
    Kisiel, Ryszard
    2013 PROCEEDINGS OF THE 36TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2013, : 90 - 93
  • [40] Silica on Si waveguides for self-aligned fibre array coupling using flip-chip Si V-groove technique
    Lai, Q
    Hunziker, W
    Melchior, H
    ELECTRONICS LETTERS, 1996, 32 (20) : 1916 - 1917
12345