SURVEYING SEMICONDUCTOR DEVICE MATERIALS.

被引：0
|
作者：
Markstein, Howard W.
机构：
来源：
Electronic Packaging and Production | 1973年 / 13卷 / 03期
关键词：
INTEGRATED CIRCUIT MANUFACTURE - SEMICONDUCTOR MATERIALS;
D O I：
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中图分类号：
学科分类号：
摘要：
For device manufacturers to complete in today's dynamic market requires continual improvements in both technology and available materials. A state-of-the-art report is presented including recent developments of encapsulants, dopants, thin films, thick films and substrates.
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页码：25 / 33
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