REFLOW SOLDERING OF HYBRID CIRCUITS.

被引：0
|
作者：
Browne, Lawrence T.
机构：
来源：
| 1600年 / 21期
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
ELECTRONIC CIRCUITS
引用
收藏
相关论文
共 50 条
  • [31] Minimizing the compromises in reflow soldering
    Vitronics Corp
    National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East), 1996, 3 : 1147 - 1153
  • [32] Foreseeing the future for reflow soldering
    Schlessmann, Heike
    McGaigue, Jack
    EP Electronic Production (London), 2003, 32 (02): : 12 - 14
  • [33] Numerical Simulation of Reflow Soldering
    Stadler, Michael
    2019 20TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2019,
  • [34] SPC analysis of reflow soldering
    KIC Thermal Profiling, San Diego, United States
    SMT Surf Mount Technol Mag, 11
  • [35] Selective soldering after reflow
    SEHO USA Inc, Ashland, United States
    Natl Electron Packag Prod Conf Proc Tech Program, (1297-1303):
  • [36] AUTOMATING THICK FILM PROCESSES IMPROVES HYBRID CIRCUITS.
    Cundy, Alan S.
    Electri-onics, 1983, 29 (11): : 27 - 30
  • [37] INFRARED REFLOW SOLDERING REEXAMINED
    ZARROW, P
    PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 788 - 796
  • [38] Telephone circuits.
    Perry, J
    PROCEEDINGS OF THE PHYSICAL SOCIETY OF LONDON, 1910, 22 : 0252 - 0272
  • [39] RECEIVER CIRCUITS.
    Crispi, F.J.
    Ritchie, L.C.
    Swietek, D.J.
    IBM technical disclosure bulletin, 1983, 25 (09): : 4832 - 4833
  • [40] TiNx THIN-FILM RESISTORS FOR HYBRID INTEGRATED CIRCUITS.
    Kempisty, Z.
    Krol-Stepniewska, L.
    Posadowski, W.
    Electrocomponent Science and Technology, 1979, 6 (3-4): : 231 - 233
12345