Hillock formation during electromigration in Cu and Al thin films: Three-dimensional grain growth

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[1] Gladkikh, A.
[2] Lereah, Y.
[3] Glickman, E.
[4] Karpovski, M.
[5] Palevski, A.
[6] Schubert, J.
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| 1600年 / American Institute of Physics Inc.卷 / 66期
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Electromigration;
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