Method to predict failure of solder joints caused by thermal shock using finite element analysis for RF power amplifier applications

被引：0
|
作者：
Yang, Michael C. [1 ]
Cienkus, Matt [1 ]
Hajovsky, Michael [1 ]
Basey, Tom [1 ]
机构：
[1] Motorola, Fort Worth, United States
来源：
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference | 2000年 / 2卷
关键词：
Correlation methods - Electronics packaging - Failure analysis - Finite element method - Heat sinks - Mathematical models - Power amplifiers - Printed circuit boards - Printed circuit design - Radio frequency amplifiers - Soldered joints - Thermal cycling;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A methodology for design option evaluation and failure possibility prediction for solder joints on single board power amplifier is presented. The method integrates the finite element analysis models and experimental data. Design improvements are verified for several sets of experimental tests.
引用
收藏
页码：169 / 173
相关论文
共 50 条
  • [41] Sensitivity analysis on the fatigue life of solid state drive solder joints by the finite element method and Monte Carlo simulation
    Yeungjung Cho
    Jinwoo Jang
    Gunhee Jang
    Microsystem Technologies, 2018, 24 : 4669 - 4676
  • [42] Thermal Analysis of Cables in Tunnel Using SUPG Finite Element Method
    Liang, Yongchun
    2011 IEEE INDUSTRY APPLICATIONS SOCIETY ANNUAL MEETING (IAS), 2011,
  • [43] FATIGUE ANALYSIS ON THERMAL CHARACTERISTICS FOR PBGA BY USING FINITE ELEMENT METHOD
    Yang, Ping
    Gong, Jie
    Yang, Haiying
    Tang, Xiushen
    JOURNAL OF THERMAL STRESSES, 2014, 37 (09) : 1052 - 1065
  • [44] Thermal Analysis of Cables in Ducts Using SUPG Finite Element Method
    Liang, Yongchun
    Sun, Xiaoyun
    2010 IEEE INDUSTRY APPLICATIONS SOCIETY ANNUAL MEETING, 2010,
  • [45] An SEM-based Finite Element Analysis of Cu-Ag Sintered Joints on Thermal Shock Reliability
    Wang, Xinyue
    Yang, Zhoudong
    Ji, Liangzheng
    Zeng, Zejun
    Chen, Haixue
    Fan, Jiajie
    Zhang, Jing
    Liu, Pan
    2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2024,
  • [46] Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model
    Kato, Mitsuaki
    Omani, Takahiro
    Goryu, Akihiro
    Fumikura, Tomoya
    Hirohata, Kenji
    JOURNAL OF ELECTRONIC PACKAGING, 2022, 144 (02)
  • [47] Winding Deformation Analysis in Power Transformers using Finite Element Method
    Sahoo, Saroja Kanti
    Gopalakrishna, S.
    2014 IEEE STUDENTS' TECHNOLOGY SYMPOSIUM (IEEE TECHSYM), 2014, : 341 - 346
  • [48] Heat analysis of the power transformer bushings using the finite element method
    Allahbakhshi, Mehdi
    Akbari, Milad
    APPLIED THERMAL ENGINEERING, 2016, 100 : 714 - 720
  • [49] Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations
    Elger, Gordon
    Kandaswamy, Shri Vishnu
    Liu, E.
    Hanss, Alexander
    Schmid, Maximilian
    Derix, Robert
    Conti, Fosca
    MICROELECTRONICS JOURNAL, 2015, 46 (12) : 1230 - 1238
  • [50] Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis
    Hu, Xingwang
    Liu, Li
    Liu, Sheng
    Ruan, Meng
    Chen, Zhiwen
    MICROMACHINES, 2023, 14 (03)
12345