Method to predict failure of solder joints caused by thermal shock using finite element analysis for RF power amplifier applications

被引：0
|
作者：
Yang, Michael C. [1 ]
Cienkus, Matt [1 ]
Hajovsky, Michael [1 ]
Basey, Tom [1 ]
机构：
[1] Motorola, Fort Worth, United States
来源：
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference | 2000年 / 2卷
关键词：
Correlation methods - Electronics packaging - Failure analysis - Finite element method - Heat sinks - Mathematical models - Power amplifiers - Printed circuit boards - Printed circuit design - Radio frequency amplifiers - Soldered joints - Thermal cycling;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A methodology for design option evaluation and failure possibility prediction for solder joints on single board power amplifier is presented. The method integrates the finite element analysis models and experimental data. Design improvements are verified for several sets of experimental tests.
引用
收藏
页码：169 / 173
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