Damage-coupled viscoplastic constitutive modeling for solder materials

被引：0

作者：

Chow, Chi Loong ^{[1
]}

Wei, Yong ^{[1
]}

机构：

[1] Department of Mechanical Engineering, University of Michigan, Dearborn, MI, United States

来源：

Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A | 2004年 / 27卷 / 06期

关键词：

Fatigue of materials - Hysteresis - Loads (forces) - Mathematical models - Metallographic microstructure - Strain rate - Thermal effects - Thermomechanical treatment - Viscoplasticity;

D O I：

10.1080/02533839.2004.9670934

中图分类号：

学科分类号：

摘要：

This paper presents a damage-coupled viscoplastic constitutive model for characterizing thermomechanical fatigue (TMF) life of solder materials. The model takes into account the effects of microstructure, temperature and strain rate in the development of damage evolution equations. The TMF model is applied to characterize hysteresis loops of two solder materials, 63Sn-37Pb and 95.5Sn-3.9Ag-0.6Cu, under both isothermal and thermomechanical cyclic loads. The TMF life prediction of 63Sn-37Pb solder has been found to be a successful model, based on the load-drop criterion, under fatigue loading.

引用

页码：835 / 840

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