Modelling and simulation of multi-layered VLSI interconnects used in high-speed communications

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作者：
Kulkarni, S.Y. [1 ]
Murthy, K.V.V. [1 ]
机构：
[1] B V B Coll of Engineering and, Technology, Hubli, India
来源：
IETE Technical Review (Institution of Electronics and Telecommunication Engineers, India) | 1998年 / 15卷 / 1-2期
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页码：111 / 118
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