In-situ calibration of wire bonder ultrasonic system using integrated microsensor

被引：0
|
作者：
Mayer, Michael [1 ]
Paul, Oliver [1 ]
Bolliger, Daniel [1 ]
Baltes, Henry [1 ]
机构：
[1] ETH Zurich, Zurich, Switzerland
来源：
Proceedings of the Electronic Packaging Technology Conference, EPTC | 1998年
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页码：219 / 223
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