Underfill material requirements for reliable flip chip assemblies

被引：0
|
作者：
Inst of Microelectronics, Singapore, Singapore [1 ]
机构：
来源：
Proceedings of the Electronic Packaging Technology Conference, EPTC | 1998年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：345 / 348
相关论文
共 50 条
  • [41] Reworkable underfill investigation on flip chip packages
    Goh, E
    Ng, LY
    Mui, YC
    PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 316 - 320
  • [42] Robust underfill selection methodology for flip chip
    Islam, Nokibul
    Jimarez, Miguel
    Darveaux, Robert
    Lee, JoonYeob
    Na, JaeYoung
    Kim, KeunSoo
    IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2, 2007, : 533 - 540
  • [43] A Study on Warpage Behavior of Underfill in Flip Chip
    Peng, Xiaohui
    Ai, Wenji
    Pan, Yan
    Zhao, Guolin
    Du, Xiaomeng
    Zhu, Pengli
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [44] Underfill of flip chip on laminates: Simulation and validation
    Nguyen, L
    Quentin, C
    Fine, P
    Cobb, B
    Bayyuk, S
    Yang, H
    Bidstrup-Allen, SA
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (02): : 168 - 176
  • [45] The underfIll processing technologies for flip chip packaging
    Chai, K
    Wu, L
    POLYTRONIC 2001, PROCEEDINGS, 2001, : 119 - 123
  • [46] Adhesion of underfill and components in flip chip encapsulation
    Fan, LH
    Moon, KS
    Wong, CP
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2002, 16 (02) : 213 - 223
  • [47] Underfill of flip chip on laminates: Simulation and validation
    Nguyen, L
    Quentin, C
    Fine, P
    Cobb, B
    Bayyuk, S
    Yang, H
    Bidstrup-Allen, SA
    3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, : 312 - 320
  • [48] Underfill encapsulant technology for flip chip assembly
    Gilleo, K
    Nicholls, G
    Ongley, PE
    PEP '97 : THE FIRST IEEE INTERNATIONAL SYMPOSIUM ON POLYMERIC ELECTRONICS PACKAGING - PROCEEDINGS, 1997, : 315 - 325
  • [49] Reworkable flip chip underfill - Materials and processes
    Nguyen, L
    Fine, P
    Cobb, B
    Tong, Q
    Ma, B
    Savoca, A
    1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 707 - 713
  • [50] Flip chip underfill flow characteristics and prediction
    Fine, P.
    Cobb, B.
    Nguyen, L.
    Proceedings - Electronic Components and Technology Conference, 1999, : 790 - 796
12345