RELIABILITY OF SURFACE MOUNTED SOLDER JOINTS UNDER PWB CYCLIC MECHANICAL STRESSES.

被引：0

作者：

Brierley, C.J. ^{[1
]}

McCarthy, J.P. ^{[1
]}

机构：

[1] Plessey Research Ltd, Towcester, Engl, Plessey Research Ltd, Towcester, Engl

来源：

Circuit World | 1986年 / 12卷 / 03期

关键词：

FAILURE ANALYSIS - SOLDERING - Reliability - STRESSES;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The advent of Surface Mounting Technology (SMT) has led to concern about the long term reliability of solder joints during environmental thermal cycling, power cycling and PWB mechanical flexure. This paper describes the results of testing PWB assemblies of both through hole and SM components in a mechanical flexure jig in which the amplitude and frequency of cycling were varied.

引用

页码：16 / 19

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