Fatigue crack growth rate in 63Sn37Pb solder joints

被引：0
|
作者：
Guo, Z. [1 ]
Conrad, H. [1 ]
机构：
[1] North Carolina State Univ, Raleigh, United States
来源：
Journal of Electronic Packaging, Transactions of the ASME | 1993年 / 115卷 / 02期
关键词：
Soldered joints;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
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页码：159 / 164
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