Feasibility of ultrasonically bonding surface mount components to printed circuit boards

被引：0
|
作者：
Goold, E. [1 ]
机构：
[1] Univ of Limerick, Ireland
来源：
Circuit World | 1989年 / 15卷 / 03期
关键词：
6;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：33 / 39
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