Moulded, plastic PGA packages

被引：0
|
作者：
Ripka, Gabor [1 ]
Szekely, Vladimir [1 ]
机构：
[1] Technical Univ of Budapest, Budapest, Hungary
来源：
Periodica Polytechnica Electrical Engineering | 1993年 / 37卷 / 01期
关键词：
Electric properties - Integrated circuit layout - Integrated circuit testing - Microprocessor chips - Plastic products - Printed circuit manufacture - Thermodynamic properties;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
The increase of the size of IC chips and the numbers of the pins made it necessary to develop a new kind of package a couple of years ago. PGA packages have appeared and have been used. The authors of this article present a new type of plastic PGA construction. The technology of the package combines the advantages of the production of moulding technologies of packages with PWB. The new plastic PGA package has good electrical and thermal properties and it is cheap. The construction and technology used allow to meet the demands of individual consumers as well - by shortening the time from design to manufacturing. The article describes in detail the testing of the thermal properties of the plastic PGA package.
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页码：53 / 72
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