Contact resistance reduction using vacuum loadlock system and plasma dry cleaning

被引:0
|
作者
机构
[1] Miya, Hironobu
[2] Shingubara, Shoso
[3] Sakaue, Hiroyuki
[4] Takahagi, Takayuki
来源
Miya, H. | 1600年 / Japan Society of Applied Physics卷 / 44期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] Contact resistance reduction using vacuum loadlock system and plasma dry cleaning
    Miya, H
    Shingubara, S
    Sakaue, H
    Takahagi, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (6A): : 3860 - 3863
  • [2] New Ar-plasma cleaning process for reduction of Al/TiSi2 contact resistance
    Tsuno, M
    Yokoyama, S
    Shibahara, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1998, 37 (11): : 5902 - 5905
  • [3] New Ar-plasma cleaning process for reduction of Al/TiSi2 contact resistance
    Tsuno, Morikazu
    Yokoyama, Shin
    Shibahara, Kentaro
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1998, 37 (11): : 5902 - 5905
  • [4] Low contact resistance metallization for gigabit scale DRAM's using fully-dry cleaning by Ar/H-2 ECR plasma
    Taguwa, T
    Urabe, K
    Sekine, M
    Yamada, Y
    Kikkawa, T
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1997, 44 (04) : 588 - 594
  • [5] DRY CLEANING OF CONTACT HOLES USING ULTRAVIOLET (UV) GENERATED OZONE
    NORSTROM, H
    OSTLING, M
    BUCHTA, R
    PETERSSON, CS
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (09) : 2285 - 2287
  • [6] Vacuum cleaning of amorphous carbon using hydrogen plasma for EUV lithography
    Yang, Guo
    Wu, Lifang
    Wang, Tao
    Wu, Xingyang
    Wang, Shenghao
    Yin, Luqiao
    Wang, Zihan
    Jiang, Lin
    Zhang, Jianhua
    MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2024, 307
  • [7] Impact of in situ oxygen plasma cleaning on the resistance of Ru and Au-Ru based rf microelectromechanical system contacts in vacuum
    Walker, M.
    Nordquist, C.
    Czaplewski, D.
    Patrizi, G.
    McGruer, N.
    Krim, J.
    JOURNAL OF APPLIED PHYSICS, 2010, 107 (08)
  • [8] Reduction in contact resistance with in situ O2 plasma treatment
    Yonekura, K
    Sakamori, S
    Kawai, K
    Miyatake, H
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1998, 145 (07) : 2480 - 2485
  • [9] Reduction of metal contact resistance of graphene devices via CO2 cluster cleaning
    Gahng, Sarang
    Ra, Chang Ho
    Cho, Yu Jin
    Kim, Jang Ah
    Kim, Taesung
    Yoo, Won Jong
    APPLIED PHYSICS LETTERS, 2014, 104 (22)
  • [10] Modeling of Contact Resistance Using Fuzzy System
    Zhong, Jianying
    Tan, Shengwu
    Wang, Gang
    Wang, Zhijun
    2016 PROGRESS IN ELECTROMAGNETICS RESEARCH SYMPOSIUM (PIERS), 2016, : 3051 - 3054