RECURSIVE ADAPTIVE EQUALIZER FOR SERIAL MSK DATA LINKS.

被引:0
|
作者
Hambley, Allan R.
Ryan, Carl R.
Gignac, James R.
机构
关键词
D O I
暂无
中图分类号
TN [电子技术、通信技术];
学科分类号
0809 ;
摘要
A microprocessor-controlled adaptive equalizer for a serial MSK communication link is described and bit error rate performance data is presented for channels with multipath.
引用
收藏
页码:35 / 39
相关论文
共 50 条
  • [21] TRANSMISSION OF DIGITAL DATA OVER TROPOSPHERIC COMMUNICATION LINKS.
    FIKS, YA.A.
    PLEKHANOV, V.V.
    1981, V 35-36 (N 11): : 30 - 33
  • [22] Low-Power Adaptive Edge Decision Feedback Equalizer for Serial Links with 4PAM Signaling
    Dolan, Matthew
    Yuan, Fei
    2017 2ND IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUITS AND MICROSYSTEMS (ICICM), 2017, : 115 - 119
  • [23] High-Speed Serial Differential Signaling Links with Commercial Equalizer
    Sevcik, Bretislav
    PROCEEDINGS OF THE 20TH INTERNATIONAL CONFERENCE, RADIOELETRONIKA 2010, 2010, : 191 - 194
  • [24] A low power 3.125 Gbps CMOS analog equalizer for serial links
    巨浩
    周玉梅
    矫逸书
    Journal of Semiconductors, 2010, (11) : 78 - 81
  • [25] A low power 3.125 Gbps CMOS analog equalizer for serial links
    Ju Hao
    Zhou Yumei
    Jiao Yishu
    JOURNAL OF SEMICONDUCTORS, 2010, 31 (11) : 1150031 - 1150034
  • [26] A Recursive Blind Adaptive Equalizer for IIR Channels with Common Zeros
    Radenkovic, Miloje S.
    Bose, Tamal
    CIRCUITS SYSTEMS AND SIGNAL PROCESSING, 2009, 28 (03) : 467 - 486
  • [27] A Recursive Blind Adaptive Equalizer for IIR Channels with Common Zeros
    Miloje S. Radenkovic
    Tamal Bose
    Circuits, Systems & Signal Processing, 2009, 28 : 467 - 486
  • [28] CHARACTERISATION OF h. f. RADIO DATA LINKS.
    McCarthy, K.P.
    Moulsley, T.J.
    Young, B.D.
    Annual Review - Philips Research Laboratories, 1986, : 90 - 94
  • [29] A 5 Gb/s CMOS adaptive equalizer for serial link
    Hongbing Wu
    Jingyu Wang
    Hongxia Liu
    Journal of Semiconductors, 2018, (04) : 70 - 75
  • [30] A 5 Gb/s CMOS adaptive equalizer for serial link
    Hongbing Wu
    Jingyu Wang
    Hongxia Liu
    Journal of Semiconductors, 2018, 39 (04) : 70 - 75