Low cost solder bumped flip chip MCM-L demonstration

被引：0
|
作者：
Kelly, M. [1 ]
Lau, J. [1 ]
机构：
[1] Hewlett-Packard Co, Palo Alto, United States
来源：
Circuit World | 1995年 / 21卷 / 04期
关键词：
Application specific integrated circuits - Electronics packaging - Flip chip devices - Integrated circuit layout - Random access storage - ROM - Surface mount technology;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A low cost multichip module employing solder bumped flip chips mounted on an organic substrate was demonstrated. This functional prototype was used to help assess the preliminary feasibility of low temperature solder bumped flip chip applications, from wafer design, sourcing and bumping, substrate design and fabrication, to MCM-L assembly.
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页码：14 / 17
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