Cellular breakdown of the planar interface in unidirectional solidification of Al- Cu alloy

被引:0
|
作者
SATO T
OHIRA G
机构
来源
| 1971年 / 12卷 / 04期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
The preferred grain boundary segregation occurred prior to the breakdown of the planar interface. Small holes appeared at random on the solidliquid interface at the beginning of the transition. The holes were aligned or distributed regularly to form an elongated cell. The solidification proceeded, entrapping the liquid phase at the bottom of the holes and resulted in the '%'rosary- like segregation'%'. The '%'rosarylike segregation'%' was also observed in hexagonal cell nodes.
引用
收藏
页码:285 / 294
相关论文
共 50 条
  • [31] Relationship between columnar crystal spacing and electric current density in unidirectional solidification of monophase Cu-Al alloy
    Chang, GW
    Cao, LY
    Yuan, JP
    Wang, ZD
    Wu, CJ
    Hu, HQ
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2002, 12 (05) : 956 - 959
  • [32] Unidirectional solidification of Zn-rich Zn-Cu hypoperitectic alloy
    Kaya, Hasan
    Engin, Sevda
    Boyuk, Ugur
    Cadirli, Emin
    Marasli, Necmettin
    JOURNAL OF MATERIALS RESEARCH, 2009, 24 (11) : 3422 - 3431
  • [33] Relationship between columnar crystal spacing and electric current density in unidirectional solidification of monophase Cu-Al alloy
    常国威
    曹丽云
    袁军平
    王自东
    吴春京
    胡汉起
    TransactionsofNonferrousMetalsSocietyofChina, 2002, (05) : 956 - 959
  • [34] Theoretical and experimental analysis of inverse segregation during unidirectional solidification of an Al-6.2 wt.% Cu alloy
    Ferreira, IL
    Siqueira, CA
    Santos, CA
    Garcia, A
    SCRIPTA MATERIALIA, 2003, 49 (04) : 339 - 344
  • [35] Predicting Secondary-Dendrite Arm Spacing of the Al-4.5wt%Cu Alloy During Unidirectional Solidification
    Ferreira, Alexandre Furtado
    de Castro, Jose Adilson
    Ferreira, Leonardo de Olive
    MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, 2017, 20 (01): : 68 - 75
  • [36] Microstructure and defect of Cu-Cr alloy during continuous unidirectional solidification
    Wang, Zidong
    Liu, Xing
    Wang, Guiqing
    Wu, Chunjing
    Xie, Jianxin
    Wong, Min
    Beijing Keji Daxue Xuebao/Journal of University of Science and Technology Beijing, 2000, 22 (06): : 543 - 546
  • [37] INVESTIGATION ON THE STABILITY OF A PLANAR INTERFACE DURING SOLIDIFICATION OF A DILUTE BINARY ALLOY(Ⅱ)
    宋柏生
    黄新芹
    何德坪
    Journal of Southeast University(English Edition), 1991, (01) : 50 - 56
  • [38] Effects of specimen dimensions on directional solidification microstructure and interface stability of Al-4.5%Cu alloy
    Jiang, Ming-Wei
    Du, Wei-Dong
    Song, Chang-Jiang
    Gao, Yu-Lai
    Zhai, Qi-Jie
    Zhuzao/Foundry, 2007, 56 (12): : 1307 - 1309
  • [39] Comparison of phase-field and cellular automaton models for dendritic solidification in Al-Cu alloy
    Choudhury, Abhik
    Reuther, Klemens
    Wesner, Eugenia
    August, Anastasia
    Nestler, Britta
    Rettenmayr, Markus
    COMPUTATIONAL MATERIALS SCIENCE, 2012, 55 : 263 - 268
  • [40] The unidirectional solidification of Al-4 wt pct Cu ingots in microgravity
    J. R. Cahoon
    M. C. Chaturvedi
    K. N. Tandon
    Metallurgical and Materials Transactions A, 1998, 29 : 1101 - 1111