Notebook computer makers address power challenges

被引：0
|
作者：
机构：
来源：
Electron Des | / 28卷 / 44期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [21] Translating the power of Coverdell fellows to address global nursing challenges
    McGhee, Stephen
    Visovsky, Constance
    Clochesy, John M.
    Finnegan, Alan
    NURSE EDUCATION TODAY, 2018, 65 : 94 - 95
  • [22] Nanofluidic Membranes to Address the Challenges of Salinity Gradient Power Harvesting
    Tong, Xin
    Liu, Su
    Crittenden, John
    Chen, Yongsheng
    ACS NANO, 2021, 15 (04) : 5838 - 5860
  • [23] IC MAKERS TARGET SUB-NOTEBOOK CPU MARKET
    MCLEOD, J
    ELECTRONICS-US, 1993, 66 (19): : 1 - 1
  • [24] Power on the Go: A Solution to Address Electric Vehicle Charging Challenges
    Kundu, Abhishake
    Feijoo, Felipe
    Mesa, Fredy
    Sankaranarayanan, Sriram
    Aristizabal, Andres J.
    Castaneda, Monica
    MATHEMATICS, 2024, 12 (01)
  • [25] Power for notebook PCs
    不详
    AMERICAN CERAMIC SOCIETY BULLETIN, 2003, 82 (11): : 8 - 8
  • [26] Governance Model and Rents Allocation in Asymmetrical Power Relations: The Case of Notebook Computer Industry
    Xiong Ying
    Ma Hai-yan
    THIRTEENTH WUHAN INTERNATIONAL CONFERENCE ON E-BUSINESS, 2014, 2014, : 547 - 554
  • [27] THE COMPUTER AND I - PARIS NOTEBOOK, A RETROSPECT
    ESTMOND, N
    ECTJ-EDUCATIONAL COMMUNICATION AND TECHNOLOGY JOURNAL, 1985, 33 (04): : 294 - 296
  • [28] Avionics databus using a notebook computer
    不详
    AIRCRAFT ENGINEERING AND AEROSPACE TECHNOLOGY, 2000, 72 (05): : 484 - 485
  • [29] Thermal design of an ultraslim notebook computer
    Kobayashi, T
    Ogushi, T
    Sumi, N
    Fujii, M
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (01): : 6 - 13
  • [30] Wear Behavior of Notebook Computer Hinges
    Su, Y. C.
    Lin, Y. C.
    JOURNAL OF THE CHINESE SOCIETY OF MECHANICAL ENGINEERS, 2016, 37 (06): : 605 - 613
12345