Reliability of electrodeposited copper and ECRCVD SiOF films for multilevel metallization

被引：0
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作者：
Lee, Seoghyeong [1 ]
Kim, Yong-An [2 ]
Lee, Kyoung-Woo [1 ]
Sohn, Seil [1 ]
Young-Il, Kim [1 ]
Yang, Sung-Hoon [1 ]
Oh, Kyunghui [3 ]
Park, Jong-Wan [1 ]
机构：
[1] Dept.of Metallurgical Engineering, Hanyang University, Seongdong-ku, Seoul 133-791, Korea, Republic of
[2] Dept. of Nanostructure Semiconductor Engineering, Hanyang University, Seongdong-ku, Seoul 133-791, Korea, Republic of
[3] Reliability Technology Div., National Institute of Technology and Quality, Kwacheon, Kyungki-do, 427-010, Korea, Republic of
来源：
Materials Research Society Symposium - Proceedings | 1999年 / 565卷
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页码：93 / 98
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