Uranium dioxide reaction in CF4/O2 RF plasma

被引：0
|
作者：
Kim, Yong-Soo [1 ]
Min, Jin-Young [1 ]
Bae, Ki-Kwang [2 ]
Yang, Myung-Seung [2 ]
机构：
[1] Department of Nuclear Engineering, Hanyang Univ., 17 Haengdang-D., Sungdong-Ku, Seoul, Korea, Republic of
[2] Korea Atom. Ener. Research Institute, P.O. Box 7, 305-606, Taejon, Korea, Republic of
来源：
Journal of Nuclear Materials | 1999年 / 270卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：253 / 258
相关论文
共 50 条
  • [31] KINETIC ASPECTS OF PLASMA-ETCHING OF POLYIMIDE IN CF4/O2 DISCHARGES
    SCOTT, PM
    BABU, SV
    PARTCH, RE
    MATIENZO, LJ
    POLYMER DEGRADATION AND STABILITY, 1990, 27 (02) : 169 - 181
  • [32] Reactive ion etching of selected polymers in O2 and in CF4/O2
    Hand, B., 1600, (47):
  • [33] Nanostructured PVDF membrane for MD application by an O2 and CF4 plasma treatment
    Jeong, Seongpil
    Shin, Bongsu
    Jo, Wonjin
    Kim, Ho-Young
    Moon, Myoung-Woon
    Lee, Seockheon
    DESALINATION, 2016, 399 : 178 - 184
  • [34] Model for photoresist trim etch in inductively coupled CF4/O2 plasma
    Rauf, S
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (01): : 202 - 211
  • [35] Effect of mixing CF4 with O2 on electron characteristics of capacitively coupled plasma
    Seol, Youbin
    Chang, Hong Young
    Ahn, Seung Kyu
    You, Shin Jae
    PHYSICS OF PLASMAS, 2023, 30 (01)
  • [36] CHARACTERIZATION OF PLASMA-ETCHING OF MOLYBDENUM POLYCID CONDUCTOR STACKS IN CL2/CF4 AND CL2/CF4/O2
    HANDKE, R
    LIPPERT, G
    CRYSTAL RESEARCH AND TECHNOLOGY, 1988, 23 (05) : 705 - 712
  • [37] INVESTIGATION OF PLASMA PARAMETERS IN DUAL ANTENNA CF4/Ar/O2 INDUCTIVELY COUPLED PLASMA
    Park, Sangho
    Han, Duksun
    Moon, Se Youn
    2016 43RD IEEE INTERNATIONAL CONFERENCE ON PLASMA SCIENCE (ICOPS), 2016,
  • [38] PARTICLE CONTAMINATION OF SILICON IN SF6 AND CF4/O2 RF ETCH PLASMAS
    SMADI, MM
    KONG, GY
    CARLILE, RN
    BECK, SE
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1992, 139 (11) : 3356 - 3363
  • [39] Surface characterization of nickel alloy plasma-treated by O2/CF4 mixture
    Chan-Park, MB
    Gao, JX
    Koo, AHL
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2003, 17 (15) : 1979 - 2004
  • [40] Optimization of silicon etch rate in a CF4/Ar/O2 inductively coupled plasma
    Levko, Dmitry
    Raja, Laxminarayan L. L.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2022, 40 (03):
12345