Technology and microstructure electroless Ni-Cu-P deposits

被引：0
|
作者：
Yu, H.S.
Luo, S.F.
Wang, Y.R.
机构：
来源：
Cailiao Gongcheng/Journal of Materials Engineering | 2001年 / 02期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [31] Corrosion behavior of hybrid coatings: Electroless Ni-Cu-P and sputtered TiN
    Valova, E.
    Georgieva, J.
    Armyanov, S.
    Avramova, I.
    Dille, J.
    Kubova, O.
    Delplancke-Ogletree, M. -P.
    SURFACE & COATINGS TECHNOLOGY, 2010, 204 (16-17): : 2775 - 2781
  • [32] Covalent grafting of PET for ultrasonic assisted electroless Ni-Cu-P plating
    Sun W.-M.
    Li B.
    Yuan X.
    Liu C.
    Shen C.-Y.
    Dai G.-C.
    Gao Xiao Hua Xue Gong Cheng Xue Bao/Journal of Chemical Engineering of Chinese Universities, 2019, 33 (06): : 1394 - 1400
  • [33] Effects of Stabilizers on Depositing Rate and Morphology of Electroless Ni-Cu-P Alloy
    王桂香
    张密林
    董国君
    景晓燕
    Journal of Rare Earths, 2006, (S2) : 233 - 237
  • [34] Research of Kinetics of Electroless Ni-Cu-P Alloy Plating on Polyester Fabric
    陈震兵
    陈小立
    Journal of DongHua University, 2002, (02) : 41 - 43
  • [35] Preparation and characterization of Ni-Cu-P/CNTs quaternary electroless composite coating
    Wu Yucheng
    Ren Rong
    Wang Fengtao
    Yuan Zaoshi
    Wang Tugen
    Hu Xiaoye
    MATERIALS RESEARCH BULLETIN, 2008, 43 (12) : 3425 - 3432
  • [36] The Influence of Plating Temperature on the Properties of Electroless Ni-Cu-P Alloys on Aluminum
    Wang, Xiran
    Lu, Hui
    Zhang, Yingwei
    Hu, Xingang
    Wu, Jing
    MANUFACTURING PROCESS TECHNOLOGY, PTS 1-5, 2011, 189-193 : 1096 - 1099
  • [37] Interface between electroless amorphous Ni-Cu-P coatings and Al substrate
    Valova, E
    Dille, J
    Armyanov, S
    Georgieva, J
    Tatchev, D
    Marinov, M
    Delplancke, JL
    Steenhaut, O
    Hubin, A
    SURFACE & COATINGS TECHNOLOGY, 2005, 190 (2-3): : 336 - 344
  • [38] Electrochemical impedance studies of modified Ni-P and Ni-Cu-P deposits in alkaline medium
    Hameed, R. M. Abdel
    Fekry, A. M.
    ELECTROCHIMICA ACTA, 2010, 55 (20) : 5922 - 5929
  • [39] MICROSTRUCTURE AND PROPERTITES OF ELECTRROLESS NI-CU-P PLATING ON POLYESTER FABRIC
    Guo Rong-hui
    Jiang Shou-qiang
    Yuen, Chun-wah M.
    Ng Man-ching
    86TH TEXTILE INSTITUTE WORLD CONFERENCE, VOL 3, CONFERENCE PROCEEDINGS, 2008,
  • [40] Influence of Cu addition on the microstructure, and corrosion behavior of electroless Ni-Cu-P coating on squeeze-cast Al-Cu-Mg alloy
    Mahton, Yogendra
    Kamde, Meeta Ashok
    Saha, Partha
    SURFACE & COATINGS TECHNOLOGY, 2024, 494
12345