Technology and microstructure electroless Ni-Cu-P deposits

被引：0
|
作者：
Yu, H.S.
Luo, S.F.
Wang, Y.R.
机构：
来源：
Cailiao Gongcheng/Journal of Materials Engineering | 2001年 / 02期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives
    Lin, KL
    Chang, YL
    Huang, CC
    Li, FI
    Hsu, JC
    APPLIED SURFACE SCIENCE, 2001, 181 (1-2) : 166 - 172
  • [2] The deposition and crystallization behaviors of electroless Ni-Cu-P deposits
    Chen, CJ
    Lin, KL
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1999, 146 (01) : 137 - 140
  • [3] A comparative study on the crystallization behavior of electroless Ni-P and Ni-Cu-P deposits
    Yu, HS
    Luo, SF
    Wang, YR
    SURFACE & COATINGS TECHNOLOGY, 2001, 148 (2-3): : 143 - 148
  • [4] Influence of Cu on the corrosion resistance of electroless Ni-Cu-P deposits on Al substrate
    College of Mechanical Engineering, South China University of Technology, Guangzhou 510640, China
    Gongneng Cailiao, 2007, 4 (683-687):
  • [5] Electroless Ni-Cu-P alloy plating
    Wu, Yiyong
    Zhang, Yongzhong
    Zhang, Jingwu
    Yao, Mei
    1997, (30):
  • [6] ELECTROLESS DEPOSITION OF NI-CU-P ALLOYS
    CHERKAOUI, M
    SRHIRI, A
    CHASSAING, E
    PLATING AND SURFACE FINISHING, 1992, 79 (11): : 68 - 71
  • [7] Research on technology and performance of electroless Ni-Cu-P plating on cemented carbide
    Luo, Juan
    Zhu, Liu
    Li, Jian
    Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2010, 31 (10): : 110 - 114
  • [8] Electroless amorphous Ni-Cu-P deposit and the interaction between Ni-Cu-P barrier and Sn solder
    Xing, Jing
    Xiao, Siyuan
    Li, Xiaofu
    Yao, Jinye
    Chen, Xiangxu
    Ma, Haitao
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [9] Electroless deposition of Ni-Cu-P alloy and study of the influences of some parameters on the properties of deposits
    Ashassi-Sorkhabi, H
    Dolati, H
    Parvini-Ahmadi, N
    Manzoori, J
    APPLIED SURFACE SCIENCE, 2002, 185 (3-4) : 155 - 160
  • [10] Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath
    Liu, Wei-Long
    Hsieh, Shu-Huei
    Chen, Wen-Jauh
    INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2009, 16 (02) : 197 - 202
12345