Third-order Δ-Σ modulator using second-order noise-shaping dynamic element matching

被引:0
|
作者
Toshiba Corp, Kawasaki, Japan [1 ]
机构
来源
IEEE J Solid State Circuits | / 12卷 / 1879-1886期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Performance of third-order ghost imaging with second-order intensity correlation
    Cao, Bin
    Zhang, Chunxi
    Ou, Pan
    CHINESE OPTICS LETTERS, 2011, 9 (08)
  • [32] Letter recognition reveals pathways of second-order and third-order motion
    Ho, C. E.
    Proceedings of the National Academy of Sciences of the United States of America, 95 (01):
  • [33] CAUCHY RELATIONS FOR SECOND-ORDER AND THIRD-ORDER ELASTIC-CONSTANTS
    MACDONALD, RA
    PHYSICAL REVIEW B-SOLID STATE, 1972, 5 (10): : 4139 - +
  • [34] SECOND-ORDER AND THIRD-ORDER OPTICAL AND MAGNETO-OPTICAL ACTIVITY
    MUKHERJEE, D
    CHOWDHURY, M
    PHYSICA, 1972, 58 (01): : 109 - +
  • [35] Letter recognition reveals pathways of second-order and third-order motion
    Ho, CE
    PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, 1998, 95 (01) : 400 - 404
  • [36] A Third-order Noise-shaping SAR ADC using PVT-insensitive Voltage-time-voltage Converter and Mismatch-Shaping
    Park, Sung-Hyun
    Park, Sang-Gyu
    Journal of Semiconductor Technology and Science, 2024, 24 (04) : 332 - 342
  • [37] A13b-ENOB Third-Order Noise-Shaping SAR ADC using a Hybrid Error-Control Structure
    Zhang, Qihui
    Li, Jing
    Zhang, Zhong
    Wu, Kejun
    Ning, Ning
    Yu, Qi
    2021 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE (CICC), 2021,
  • [38] Commentary: First-Order Embodiment, Second-Order Embodiment, Third-Order Embodiment
    Quadt, Lisa
    FRONTIERS IN PSYCHOLOGY, 2018, 9
  • [39] A second-order noise-shaping SAR ADC with error-feedback structure and data weighted averaging
    Zhang, Qihui
    Li, Jing
    Ning, Ning
    Yu, Qi
    Wu, Kejun
    Zhang, Zhong
    MICROELECTRONICS JOURNAL, 2020, 105
  • [40] Fully passive third-order noise shaping SAR ADC
    Payandehnia, P.
    Mirzaie, H.
    Maghami, H.
    Muhlestein, J.
    Temes, G. C.
    ELECTRONICS LETTERS, 2017, 53 (08) : 528 - 530