GREATER PACKAGING DENSITY THROUGH DIRECT SURFACE MOUNTING OF COMPONENTS.

被引：0
|
作者：
Goel, R.P. [1 ]
机构：
[1] AMP Inc, Harrisburg, PA, USA, AMP Inc, Harrisburg, PA, USA
来源：
SMT Surface Mount Technology Magazine | 1986年
关键词：
DENSER PACKAGING - DIRECT SURFACE MOUNTING - PACKAGING DENSITY - PCB - PRINTED CIRCUIT BOARD SURFACES;
D O I：
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中图分类号：
学科分类号：
摘要：
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页码：17 / 20
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