Curing and thermal behavior of epoxy resin in the presence of silicon-containing amide amines

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[1] Khurana, Parveen
[2] Aggarwal, S.
[3] Narula, A.K.
[4] Choudhary, Veena
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Narula, A.K. (akn57@usa.net) | 1600年 / John Wiley and Sons Inc.卷 / 87期
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