Further developments in the CO2 laser cutting of ceramic tile

被引：0
|
作者：
Chua, K.L.
Black, I.
机构：
来源：
Lasers in Engineering | / 6卷 / 04期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：291 / 314
相关论文
共 50 条
  • [21] Cutting of slate tiles by CO2 laser
    Boutinguiza, M
    Lusquiños, F
    Pou, J
    Soto, R
    Quintero, F
    Pérez-Amor, M
    Watkins, K
    ICALEO(R) 2000: PROCEEDINGS OF THE LASER MATERIALS PROCESSING CONFERENCE, VOL 89, 2000, 89 : B107 - B115
  • [22] A study into CO2 laser cutting process
    Yilbas, BS
    HEAT AND MASS TRANSFER, 1997, 32 (03): : 175 - 180
  • [23] CO2 laser cutting of calcareous stones
    Miranda, RM
    Quintino, L
    MATERIALS AND MANUFACTURING PROCESSES, 2004, 19 (06) : 1133 - 1142
  • [24] CO2 laser cutting of stained glass
    Finucane, MA
    Black, I
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 1996, 12 (01): : 47 - 59
  • [25] CO2 laser cutting of natural granite
    Riveiro, A.
    Mejias, A.
    Soto, R.
    Quintero, F.
    del Val, J.
    Boutinguiza, M.
    Lusquinos, F.
    Pardo, J.
    Pou, J.
    OPTICS AND LASER TECHNOLOGY, 2016, 76 : 19 - 28
  • [26] Laser cutting speeds for ceramic tile: a theoretical-empirical comparison
    Black, I
    OPTICS AND LASER TECHNOLOGY, 1998, 30 (02): : 95 - 101
  • [27] Cutting with a CO2 laser, (Schneiden mit einem CO2- Laser)
    BRANDT G
    SPENGELIS B
    VAN HULLE J
    Schweissen und Schneiden/Welding and Cutting, 1971, 23 (02): : 56 - 59
  • [28] A study into CO2 laser cutting processUntersuchung des mittels CO2 -Laser erfolgenden Schneidprozesses
    B. S. Yilbas
    Heat and Mass Transfer, 1997, 32 (3) : 175 - 180
  • [29] CO2 laser cutting:: kerf width variation during cutting
    Uslan, I
    PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 2005, 219 (08) : 571 - 577
  • [30] CO2 and CO laser comparison of glass and ceramic processing
    Shi, Ce
    Ermold, Michael
    Oulundsen, George
    Newman, Leon
    HIGH-POWER LASER MATERIALS PROCESSING: APPLICATIONS, DIAGNOSTICS, AND SYSTEMS VIII, 2019, 10911
12345