JUNCTION DEPTH MEASURING METHODS: THE PROS AND CONS.

被引：0
|
作者：
Aley, Carl L.
Turner, R.Scott
机构：
来源：
Semiconductor International | 1980年 / 3卷 / 05期
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D O I：
暂无
中图分类号：
TN [电子技术、通信技术];
学科分类号：
0809 ;
摘要：
This review of junction depth measuring techniques for semiconductor materials examines their advantages and limitations for different applications. Both nondestructive and junction exposure methods are characterized in detail, including discussion of their accuracy, versatility and cost.
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页码：135 / 146
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