Influence exerted on the uniformity and properties of coatings by the composition of the sulfate electrolyte and copper-plating regime

This work investigates the effect of the content of basic components of a copper-plating sulfate electrolyte and the electrodeposition conditions on the distribution of copper on model cathodes, and also on the physicomechanical properties of the coating. It was found that an increase in the sulfuric acid concentration, a reduction in the cathodic current density and copper sulfate concentration, and intensification of agitation contribute to an increase in the uniformity of the distribution of copper coatings on articles with through holes. The plasiticity of the deposits increases with decreasing acidity of the electrolyte, increasing content of copper ions in the electrolyte, and intensifying the agitation, and the electrical resistance is virtually independent of the composition of the electrolyte and the electrodeposition regime.