Au wire bonding to Cu pad using Ti thin film

被引：0
|
作者：
Ueno, Hiroshi [1 ]
机构：
[1] Clarion Co, Ltd, Fukushima, Japan
来源：
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 1992年 / 31卷 / 5 A期
关键词：
539 Metals Corrosion and Protection; Metal Plating - 542 Beryllium; Lithium; Magnesium; Titanium and Other Light Metals and Alloys - 544 Copper and Alloys - 547 Minor; Precious and Rare Earth Metals and Alloys - 704 Electric Components and Equipment;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
10
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页码：1547 / 1548
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