TWO-COMPONENT PHOTORESIST PROCESS FOR CONDUCTORS.

被引:0
|
作者
Lahiri, S.K.
Suierveld, J.
机构
来源
IBM technical disclosure bulletin | 1984年 / 26卷 / 11期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Two-component systems
    Papon, Nicolas
    Stock, Ann M.
    CURRENT BIOLOGY, 2019, 29 (15) : R724 - R725
  • [32] Simulation of Two-Component Development Process for Front loading Design
    Nakayama, Nobuyuki
    Ito, Tomoyuki
    Watanabe, Youichi
    Hirooka, Nobuyuki
    Seko, Tomohiro
    NIP 25: DIGITAL FABRICATION 2009, TECHNICAL PROGRAM AND PROCEEDINGS, 2009, : 241 - 244
  • [33] Modeling and Control of a Hybrid Two-Component Development Process for Xerography
    Liu, Feng
    Chiu, George T-C.
    Hamby, Eric S.
    Eun, Yongsoon
    IEEE TRANSACTIONS ON CONTROL SYSTEMS TECHNOLOGY, 2011, 19 (03) : 531 - 544
  • [34] Total synthesis of isoprostanes via the two-component coupling process
    Rodríguez, AR
    Spur, BW
    TETRAHEDRON LETTERS, 2002, 43 (26) : 4575 - 4579
  • [35] Electromigration in Aluminum Printed Conductors.
    Hersener, Juergen
    Ricker, Thomas
    Wissenschaftliche Berichte AEG-Telefunken, 1975, 48 (2-3): : 46 - 54
  • [36] The resistance of certain complex conductors.
    Lichtenecker, K
    PHYSIKALISCHE ZEITSCHRIFT, 1918, 19 : 374 - 382
  • [38] HELICON MODULATION INSTABILITY IN CONDUCTORS.
    Demikhovskiy, V.Ya.
    Savinskiy, S.S.
    Physics of Metals and Metallography, 1984, 57 (05): : 25 - 32
  • [39] Welding of Insulated Copper Conductors.
    Krolo, Ante
    Zavarivanje, 1987, 30 (04) : 213 - 217
  • [40] The breakdown effect in boron conductors.
    Lyle, FW
    PHYSICAL REVIEW, 1918, 11 (04): : 253 - 260