SIZE CHARACTERIZATION OF STRESS CRACKS IN CORN KERNELS.

被引：0

作者：

Gunasekaran, S. ^{[1
]}

Deshpande, S.S. ^{[1
]}

Paulsen, M.R. ^{[1
]}

Shove, G.C. ^{[1
]}

机构：

[1] Univ of Delaware, Newark, DE, USA, Univ of Delaware, Newark, DE, USA

来源：

Transactions of the American Society of Agricultural Engineers | 1985年 / 28卷 / 05期

关键词：

MICROSCOPES; ELECTRON; -; STRESSES; Analysis;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Scanning electron microscopic pictures were taken of corn kernels from four different varieties, all dried at a high temperature. Stress cracks were observed to originate at the inner core of the floury endosperm and propagate radially outward along the boundary of starch granules. Many cracks did not advance far enough to open up at the surface underneath the pericarp. An average stress crack was measured to be 58 plus or minus 14 mu m in width at its widest part.

引用

页码：1668 / 1672

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