Mechanism of corrosion in Al-Si-Cu

被引:0
|
作者
Hayasaka, Nobuo [1 ]
Koga, Yuri [1 ]
Shimomura, Koji [1 ]
Yoshida, Yukimasa [1 ]
Okano, Haruo [1 ]
机构
[1] Toshiba Corp, Kawasaki, Japan
关键词
Electromotive Force;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:1571 / 1575
相关论文
共 50 条
  • [41] Thermodynamic and Kinetic Study for Corrosion of Al-Si-Cu/Y2O3 Composites
    Anaee, Rana Afif Majed
    ASIAN JOURNAL OF CHEMISTRY, 2014, 26 (14) : 4469 - 4474
  • [42] Influence of Si, Cu, B, and Trace Alloying Elements on the Conductivity of the Al-Si-Cu Alloy
    Yang, Zhao
    He, Xiaolong
    Li, Bin
    Atrens, Andrej
    Yang, Xuyue
    Cheng, Hanming
    MATERIALS, 2022, 15 (02)
  • [43] POSTTREATMENTS FOR REACTIVE ION ETCHING OF AL-SI-CU ALLOYS
    MAYUMI, S
    HATA, Y
    HUJIWARA, K
    UEDA, S
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (08) : 2534 - 2538
  • [44] Effect of Ce on morphology of α(Al)-Al2Cu eutectic in Al-Si-Cu alloy
    Voncina, Maja
    Medved, Jozef
    Boncina, Tonica
    Zupanic, Franc
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2014, 24 (01) : 36 - 41
  • [45] The fatigue damage development in a cast Al-Si-Cu alloy
    Dietrich, Lech
    Radziejewska, Joanna
    MATERIALS & DESIGN, 2011, 32 (01) : 322 - 329
  • [46] SIMULATIONS OF THE SHRINKAGE POROSITY OF Al-Si-Cu AUTOMOTIVE COMPONENTS
    Lavtar, Lejla
    Petric, Mitja
    Medved, Jozef
    Taljat, Bostjan
    Mrvar, Primoz
    MATERIALI IN TEHNOLOGIJE, 2012, 46 (02): : 177 - 180
  • [47] Microstructural Observations in a Cast Al-Si-Cu/TiC Composite
    Karantzalis, A. E.
    Lekatou, A.
    Georgatis, E.
    Poulas, V.
    Mavros, H.
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2010, 19 (04) : 585 - 590
  • [48] ELECTRON-CYCLOTRON RESONANCE ETCHING OF AL-SI-CU
    HALL, A
    NOJIRI, K
    SOLID STATE TECHNOLOGY, 1991, 34 (05) : 107 - 111
  • [49] Local pressurization during solidification of Al-Si-Cu alloys
    Wan, L
    Nakashima, T
    Kato, E
    Nomura, H
    INTERNATIONAL JOURNAL OF CAST METALS RESEARCH, 2002, 15 (03) : 187 - 192
  • [50] Al-Si-Cu合金工艺的特点
    冯俊
    电子工艺技术, 2002, (04) : 174 - 176+180