MEASLING IN GLASS REINFORCED EPOXY PRINTED CIRCUIT LAMINATES.

被引:0
|
作者
Vaughan, D.J.
机构
来源
Insulation/Circuits | 1972年 / 18卷 / 13期
关键词
EPOXY RESINS - LAMINATED PRODUCTS;
D O I
暂无
中图分类号
学科分类号
摘要
Measling can be attributed to entrapped volatile materials present in the composite structure. In looking for ways to overcome this problem, and at the same time to improve the performance of the laminates, the silane family of finishing agents has been investigated. With the development of a variety of organo-functional silane coupling agents, a material is found that is capable of reacting with, and forming covalent chemical bonds with, both organic polymer and inorganic glass. This bridging of the interface between resin and reinforcement provides good adhesion, and the stability of the covalent linkage maintains this adhesion under adverse environmental conditions.
引用
收藏
页码:32 / 33
相关论文
共 50 条
  • [31] THE INPLANE THERMAL-EXPANSION OF GLASS FABRIC REINFORCED EPOXY LAMINATES
    YUAN, J
    FALANGA, LA
    JOURNAL OF REINFORCED PLASTICS AND COMPOSITES, 1993, 12 (04) : 489 - 496
  • [32] New Epoxide Impregnant for the Manufacture of Copper-Clad Glass-Fiber Reinforced Epoxide Laminates.
    Baniak, Antoni
    Bak, Jozef
    Tracz, Elzbieta
    Polimery/Polymers, 1984, 29 (09) : 351 - 353
  • [33] Characterization for Viscoelasticity of Glass Fiber Reinforced Epoxy Composite and Application to Thermal Warpage Analysis in Printed Circuit Board
    Song, Woo-Jin
    Ku, Tae-Wan
    Kang, Beom-Soo
    Kim, Jeong
    TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A, 2010, 34 (02) : 245 - 253
  • [34] FATIGUE DAMAGE - MECHANICS OF CARBON-FIBRE REINFORCED LAMINATES.
    Poursartip, A.
    Ashby, M.F.
    Beaumont, P.W.R.
    Cambridge University, Engineering Department (Technical Report) CUED/C-MATS, 1983,
  • [35] Effect of Reflow Process on Glass Transition Temperature of Printed Circuit Board Laminates
    Lall, Pradeep
    Narayan, Vikalp
    Suhling, Jeff
    Blanche, Jim
    Strickland, Mark
    2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2012, : 261 - 268
  • [36] The effect of epoxy/glass interfaces on CAF failures in printed circuit boards
    Sood, Bhanu
    Pecht, Michael
    MICROELECTRONICS RELIABILITY, 2018, 82 : 235 - 243
  • [37] Effect of climatic and radiation ageing on properties of glass fibre reinforced epoxy laminates
    Startsev, OV
    Krotov, AS
    Golub, PD
    POLYMERS & POLYMER COMPOSITES, 1998, 6 (07): : 481 - 488
  • [38] Rotary mode ultrasonic drilling of glass fiber-reinforced epoxy laminates
    Debnath, Kishore
    Singh, Inderdeep
    Dvivedi, Akshay
    JOURNAL OF COMPOSITE MATERIALS, 2015, 49 (08) : 949 - 963
  • [39] Moisture transmission through aramid, polyethylene and glass fibre reinforced epoxy laminates
    Ghotra, JS
    Mackay, P
    POLYMERS & POLYMER COMPOSITES, 1999, 7 (02): : 79 - 88
  • [40] Moisture transmission through aramid, polyethylene and glass fibre reinforced epoxy laminates
    School of Applied Chemistry, Kingston University, Penrhyn Road, Surrey, KT1 2EE, United Kingdom
    Polym Polym Compos, 2 (79-88):