SHIELDING OF ELECTROMAGNETIC FIELDS OF CURRENT SOURCES BY HEMISPHERICAL ENCLOSURES.

被引：0

作者：

Shastry, S.V.K. ^{[1
]}

Shamanna, K.N. ^{[1
]}

Katti, V.R. ^{[1
]}

机构：

[1] Indian Space Research Organ, Bangalore, India, Indian Space Research Organ, Bangalore, India

来源：

IEEE Transactions on Electromagnetic Compatibility | 1985年 / EMC-27卷 / 04期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：184 / 190

共 50 条

[1] SHIELDING OF ELECTROMAGNETIC-FIELDS OF CURRENT SOURCES BY HEMISPHERICAL ENCLOSURES
SHASTRY, SVK
SHAMANNA, KN
KATTI, VR
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 1985, 27 (04) : 184 - 190
[2] RFI SHIELDING OF ENCLOSURES.
Nigel, May
Electronic Engineering (London), 1983, 55 (677): : 77 - 78
[3] ENSURING THE SHIELDING OF CABINETS AND ENCLOSURES.
Hobbins, K.A.W.
New Electronics, 1987, 20 (14):
[4] MOLDING OF EMI AND RFI SHIELDING INTO PRODUCT ENCLOSURES.
Anon
IBM technical disclosure bulletin, 1985, 27 (10 B):
[5] FUNDAMENTALS OF STEADY-STATE AND TRANSIENT ELECTROMAGNETIC-FIELDS IN SHIELDING ENCLOSURES
FRANCESCHETTI, G
SCHULZ, RB
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 1979, 21 (04) : 335 - 348
[6] NEW ELECTROMAGNETIC SHIELDING TECHNIQUE FOR METAL ENCLOSURES
HARADA, T
HAYASHI, S
HATAKEYAMA, K
NEC RESEARCH & DEVELOPMENT, 1991, 32 (04): : 511 - 519
[7] Electromagnetic shielding degradation effects in composite material enclosures
James, JR
Race, AJ
Scott, LA
ELECTRONICS LETTERS, 1999, 35 (03) : 209 - 211
[8] Technique for Locating RF Leaks in the Flooring of Electromagnetic Shielding Enclosures
Gaidosh, Marc
2020 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND SIGNAL & POWER INTEGRITY VIRTUAL SYMPOSIUM(IEEE EMC+SIPI), 2020, : 537 - 542
[9] Measured electromagnetic shielding of small composite enclosures/junction boxes
Hoeft, LO
Bergsrud, B
Young, T
2001 IEEE EMC INTERNATIONAL SYMPOSIUM, VOLS 1 AND 2, 2001, : 697 - 701
[10] Investigation of Shielding Materials, for the Purpose of Shielding Electromagnetic Fields
Zbojovsky, Jan
Pavlik, Marek
Kolcunova, Iraida
Kurimsky, Juraj
Cimbala, Roman
ACTA POLYTECHNICA HUNGARICA, 2023, 20 (11) : 49 - 62

← 1 2 3 4 5 →