MOLDING OF EMI AND RFI SHIELDING INTO PRODUCT ENCLOSURES.

被引：0

作者：

Anon

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来源：

IBM technical disclosure bulletin | 1985年 / 27卷 / 10 B期

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摘要：

ELECTROMAGNETIC SHIELDING

引用

共 50 条

[1] RFI SHIELDING OF ENCLOSURES.
Nigel, May
Electronic Engineering (London), 1983, 55 (677): : 77 - 78
[2] RFI SHIELDING OF ENCLOSURES
MAY, N
ELECTRONIC ENGINEERING, 1983, 55 (677): : 77 - 78
[3] ENSURING THE SHIELDING OF CABINETS AND ENCLOSURES.
Hobbins, K.A.W.
New Electronics, 1987, 20 (14):
[4] TIPS FOR CONTROLLING EMI THROUGH ENCLOSURES.
Howard, Herb
Electronic Packaging and Production, 1987, 27 (03): : 91 - 92
[5] EMI/RFI shielding
Rajam, K.S.
Journal of the Electrochemical Society of India, 1994, 43 (03): : 191 - 196
[6] EMI RFI SHIELDING
KRULIK, GA
INDUSTRIAL FINISHING, 1983, 59 (05): : 16 - 18
[7] Designing enclosures to minimize EMI/RFI
Hinton, B
Baxter, R
CONTROL ENGINEERING, 1996, 43 (08) : 65 - 66
[8] EMI/RFI shielding materials
不详
ELECTRONIC PRODUCTS MAGAZINE, 1997, 40 (04): : 63 - 64
[9] METALIZING FOR EMI RFI SHIELDING
STORMS, CD
METAL FINISHING, 1983, 81 (02) : 47 - 51
[10] EMI RFI SHIELDING OF PLASTICS
GRESHAM, RM
PLATING AND SURFACE FINISHING, 1988, 75 (02): : 63 - 69